- Tue Oct 08, 2019 4:56 pm
#208424
Are there any special requirements for soldering an Artemis module to another board? It seems to me like it could be more complicated than a typical part being soldered to a board.
I use a toaster oven reflow machine, and my control of the temperature profile will not be as good as a real reflow machine that you must be using in your production flow. Mostly, I am worried that my sub-optimal reflow temperature profile will potentially mess up the solder joints between the Apollo3 BGA pads and the Artemis module itself. If that happens, then both boards become trash. Also, I put down the solder paste by hand. How sensitive are the module pads to having variations in the amount of solder on the pads?
I figure that the Sparkfun folks must have gained some good experience constructing the Redboards. Are there any tricks to be aware of?
I use a toaster oven reflow machine, and my control of the temperature profile will not be as good as a real reflow machine that you must be using in your production flow. Mostly, I am worried that my sub-optimal reflow temperature profile will potentially mess up the solder joints between the Apollo3 BGA pads and the Artemis module itself. If that happens, then both boards become trash. Also, I put down the solder paste by hand. How sensitive are the module pads to having variations in the amount of solder on the pads?
I figure that the Sparkfun folks must have gained some good experience constructing the Redboards. Are there any tricks to be aware of?