Just to close this thread out: I have now soldered down two Artemis modules using a toaster oven. Both tries were successful. I placed the solder by hand for the first module using the tip of xacto knife and a microscope. That was a difficult job, but not impossible. I guess it might have taken me 30 mins to do all the Artemis pads. The second module, I used a stencil. It took about 1 second to wipe on the solder. The result looked great. The stencil sure seems the way to go.
I did alter my toaster oven software before doing the soldering. I got rid of all the PID control because it seemed to be a lot of complication that didn't work very well. The PID controller was letting the interior start cooling again before starting the reflow phase, which seemed bad. What I found worked well for my 4-element toaster oven using a no-clean leaded solder formula paste:
- apply full power until the interior hits 100F, then shut the power off
- Let the oven temp coast upwards as the elements cool down
- When the interior temp coasts up to 120F, I turn on full power again
- keep power on until the temp hits 220F, then power off and open the door
I am attaching a pic of the resulting reflow profile.
Bottom line: Artemis modules appear to be solderable just fine using a toaster oven.
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