- Mon Dec 23, 2013 2:34 pm
#166796
Hi,
This is my first time creating footprints for eagle and I was hoping to get some feedback on the footprint I made for the TI LM5113. It is a small DSBGA package with 12 pins. My biggest concern is that after viewing all layers on the footprint, it appears that what I think is the solder mask is overlapping between each ball. I used the "land pattern recommendation" to create it. The footprint is given below
The actual data sheet is image is here:
To summarize, my questions are: 1 - Is it generally ok to use the land pattern recommendation without adding any extra size to smd pad sizes? 2 - Is the overlapping solder mask an issue and if so, what would be the proper way to fix it?
Thanks for any input!!
This is my first time creating footprints for eagle and I was hoping to get some feedback on the footprint I made for the TI LM5113. It is a small DSBGA package with 12 pins. My biggest concern is that after viewing all layers on the footprint, it appears that what I think is the solder mask is overlapping between each ball. I used the "land pattern recommendation" to create it. The footprint is given below
The actual data sheet is image is here:
To summarize, my questions are: 1 - Is it generally ok to use the land pattern recommendation without adding any extra size to smd pad sizes? 2 - Is the overlapping solder mask an issue and if so, what would be the proper way to fix it?
Thanks for any input!!
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