SparkFun Forums

[zxm2164]

Hi,

This is my first time creating footprints for eagle and I was hoping to get some feedback on the footprint I made for the TI LM5113. It is a small DSBGA package with 12 pins. My biggest concern is that after viewing all layers on the footprint, it appears that what I think is the solder mask is overlapping between each ball. I used the "land pattern recommendation" to create it. The footprint is given below

LM5113DSBGA.PNG

The actual data sheet is image is here:

Land Pattern LM5113.jpg

To summarize, my questions are: 1 - Is it generally ok to use the land pattern recommendation without adding any extra size to smd pad sizes? 2 - Is the overlapping solder mask an issue and if so, what would be the proper way to fix it?


Thanks for any input!!

[Ross Robotics]

1. the land pattern sizes in the datasheet are there for a reason. Use the recommended pattern..
2. If you don't use a ton of solder, then it's ok. The way it is now, you will not have a stop mask between pins which could prevent solder bridges. Right click on the mask and hit properties, change size.

[zxm2164]

Okay, thanks codlink, I'll revisit it and change the mask size