- Wed Aug 28, 2013 6:18 am
#162969
I'm working on a capacitive touch PCB, and have a couple issues that I hope y'all can answer for me:
1) I've installed vias to tie the sensor copper pad on Top to the Bottom layer. However, it looks like these pads have a dead zone around them, whereas I actually want the larger copper pad to be integrated with them. Is there a way to adjust the via holes, or should I be approaching this differently?
2) Pin 12 on my connector will carry ground to the sensor board for signal shielding, but my hatched polygon ground fill is not attaching to it. I thought assigning "GND" to the pad and the poly would connect them. What have I done wrong here?
I've attached a .png of the board.
And kinda goes without saying: I'd love any other comments on the PCB design. I'm quite the n00b here.
Mucho Thanks,
-g
1) I've installed vias to tie the sensor copper pad on Top to the Bottom layer. However, it looks like these pads have a dead zone around them, whereas I actually want the larger copper pad to be integrated with them. Is there a way to adjust the via holes, or should I be approaching this differently?
2) Pin 12 on my connector will carry ground to the sensor board for signal shielding, but my hatched polygon ground fill is not attaching to it. I thought assigning "GND" to the pad and the poly would connect them. What have I done wrong here?
I've attached a .png of the board.
And kinda goes without saying: I'd love any other comments on the PCB design. I'm quite the n00b here.
Mucho Thanks,
-g
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