I have been using a toaster oven for SMD reflow quite successfully for about 4 years now. I've reflowed thousands (literally) of small dual sided boards. Toaster oven was mom's old one (read: free) and is much smaller than the one in the tutorial. Rememer that the bigger the oven, the more thermal inertia it will have, making it harder to control.
The first time I used it, I burned a batch of boards. I found that since the two bottom elements were placed one above the other in the center, there was a hot spot. This was easily fixed by putting a 4x6" piece of aluminum above them. Since aluminum transfers heat very well, it tends to diffuse the heat acoss it. It also acts like a buffer to keep the oven from changing temperature too fast.
I made a little stand for my boards. They are double sided (and I do both sides at the same time) so they need to be suspended. I placed a thermocouple directly under the board. BTW, all my boards are hand pasted using an electronic dispensor, a syringe and a lot of patience. But after seeing the cheap stencills here, I might be converting!
Using the 'toast' mode, I manually modulate the the toast switch to follow the reflow curve. Initially, the oven will heat up at just about the right 'preheat' rate. Once I get close to 140, I turn it off. The temp will continue to rise but will start to level off just like the profile. Once 160 is reached, I will again turn it on and spike it up to about 200. I'll turn the oven off, but the temp will continue to rise. I'll leave the door closed until 215-220 and then open it enough to allow the temp to start to drop at a gradual rate. Waite 5 minutes before trying to move the board. (I dropped a board that was still 'wet', thinking it was cool enough and all the parts came flying off the board.)
After a few runs, you learn how not to overshoot your target temp and using my scopemeter trend-plot feature, I can match the reflow profile exactly. I have thought of making something to do this automatically, but its so easy to do it myself it wasn't worth it.
A couple of comments to the admin. From what I read on your site, you were having problems with the USB connectors not reflowing or burning other connectors.. If you are ramping the temp up like the profile you have here
this could be your problem. The 'soak' period is important to get all the components up to just under reflow temp. You profile doesnt have a soak period. Try to let them soak at 160 for 30-60 seconds and see if it helps.
I also think that solid state would be the way to go here.
-Mike