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Questions relating to designing PCBs
By artelse
#33957
Just a simple question. When I try to hot air remove an IC from a PCB, what temperature setting would be appropriate? Solder melts around 230C or so, but when I use say 250C air temp, it takes ages and won't melt the solder.

By using a much higher setting, 300+C, I can get the part off, but what temp are people using here? What is ideal without toasting the component and/or board?

It could also be the hot air temp displayed on the Aoyue is not accurate and possibly just the temp of the gun element.

Thanks for sharing.

ae
By Philba
#33966
Do you set your soldering iron tip temperature to 230? No, typically, 600F+ is what one needs.

Hot air temperature is similar. I tune my temperature and flow rate to take around 2-3 seconds to melt the solder. Of course, it depends on which nozzle you are using. I use a skinny little tube one and try to keep the flow pretty low since it can [edit: er, can't) blow the small chips right off the board.
Last edited by Philba on Mon Aug 20, 2007 8:11 pm, edited 1 time in total.
By artelse
#34019
600F is ~315C as what worked for me.

Thanks.