- Mon Aug 20, 2007 9:09 am
#33957
Just a simple question. When I try to hot air remove an IC from a PCB, what temperature setting would be appropriate? Solder melts around 230C or so, but when I use say 250C air temp, it takes ages and won't melt the solder.
By using a much higher setting, 300+C, I can get the part off, but what temp are people using here? What is ideal without toasting the component and/or board?
It could also be the hot air temp displayed on the Aoyue is not accurate and possibly just the temp of the gun element.
Thanks for sharing.
ae
By using a much higher setting, 300+C, I can get the part off, but what temp are people using here? What is ideal without toasting the component and/or board?
It could also be the hot air temp displayed on the Aoyue is not accurate and possibly just the temp of the gun element.
Thanks for sharing.
ae