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Bergamot wrote:Yeah, I forgot to mention that the design is completely through-hole. and that the main reason I wanted to use a power plane was design simplicity.Greetings Bergamot,
It seemed to me that it should work from a digital perspective, since it shouldn't matter much what shape the chunk of metal is in as long as it isn't too small, but I wanted to make sure there weren't any analog factors i was overlooking.
bigglez wrote:The most important thing is not to add too much capacitance (with large ground planes) as it may stall the oscillator. Such a problem is very hard to fix (spin the PCB design...)Read the whole thread here.
Next on the list is to keep all other signals away from the RTC Xtal pins for fear of coupling in noise.
Finally, if you are looking for accuracy add a small trimmer cap across the crystal. Once the pads are in place you have the option of deleting the trimmer, but adding one after the fact is not so easy.
Take a look at the Dallas/Maxim app. note number 58, here.
Here's a layout I'm using for the DS1307 (8SOT) version (Battery back up and 1PPS led, I2C bus pull up and matching resistors):
On a double-sided 0.063 thick PCB (BatchPCB for example) the ground plane on the bottom layer will be okay. Thinner boards (or multi-layer with internal ground planes) are a problem.
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