Does anyone have any advice for creating complex (ie not rectangular) pads when creating a new package in the library?
Specifically, I'm looking at the TI TPS6300x chips (datasheet) which come in a powerpad package. I've tried creating the chip with three overlapping SMD pads for the powerpad, but this causes a DRC clearance error. As a check, I looked at powerpad chips in the default TI Eagle library and those chips give the same error.
I've tried renaming all three pads to the same name, but that isn't allowed, and I don't see an option in the package editor to connect them