I am a newbie in PCB design,and I would like to ask you your thought about the article--" How to optimize the thermal design of printed circuit board layout",I saw it from a google blogger.
In the paper, it describes how to use thermal simulation to optimize the heat dissipation performance of PCB board. The PCB plate is locked in the chassis by a wedge and is forced to air cooling on the radiator fins outside the chassis. Under some harsh environmental conditions, according to local ambient air temperature and heat conduction as the main way of cooling, how to achieve normal junction temperature has become a major problem. It divided into six parts to explain its article core,"why--Initial layout scheme--Design goals and limitations--Thermal simulation--Response surface--Conclusion", you know,this article has no any comment.So I am confusing about if it's a good article and it has a right view.
The article link I have already added,please tell me you thought about it.Thank you very much. Any wrong in grammar please forgive me.
Thank you again.