I am looking for considerations to keep in mind while designing a pcb(Only double sided available) with high speed signals (upto 100MHz).
What I know up till know:
1)Using small traces to get low inductance and capacitance.
2)Using a complete layer of the two sided pcb as ground plane to act as a decoupling capacitor.
3)Avoid removing any part from the ground layer so that the return current is exactly under the signal current.
4) Would using smds be a better option than through hole components and why?
5) If I use smds, I would have to use vias to provide ground is using vias for ground and also other connections a good option?
6)What other techniques can be used to minimize the stray capacitances and inductances at high frequency.
7)What is with the transmission line termination and control impedance?
8)Microstrip:what is it ? In case of double sided pcb with one ground layer and the other etched part is this microstrip?
9)What should I do with the power should it be provided on the etched side?
Please correct me where wrong Please try to answer all it would really help me.
Any Idea , Suggestions would be appreciated,
I didn't find the right solution from the internet.
References:https://forum.allaboutcircuits.com/thre ... ign.99571/