- Mon Sep 21, 2015 2:52 am
#184844
Greetings!
I have a problem with connection of pads in 4-layer PCB (signal1-GND-POWER-signal2). Sometimes the pad doesen't connect to inner layers of the board. For all pads i use a termal relief for the pad to connect to power plane.
So my question, is it necesary that the pads in inner layers have termal relief?
Will this solve my problem?
What are the bennefits of using relief in inner layers and what are the disadvantages?
If someone had the same problem, please help me.
I have a problem with connection of pads in 4-layer PCB (signal1-GND-POWER-signal2). Sometimes the pad doesen't connect to inner layers of the board. For all pads i use a termal relief for the pad to connect to power plane.
So my question, is it necesary that the pads in inner layers have termal relief?
Will this solve my problem?
What are the bennefits of using relief in inner layers and what are the disadvantages?
If someone had the same problem, please help me.
