Where electronics enthusiasts find answers.
RC wrote:If the Pads layer is on the bottom of the board, how do a create a header that is installed on the bottom of the board with solder pads on the top like SFE's breadboard supply?That's a wrong assumption, the Pads layer is independent
RC wrote:how do a create a header that is installed on the bottom of the board with solder pads on the top like SFE's breadboard supply? Thanks.If you use the mirror tool (the icon is a rectangle with a dotted line across the middle, and it's immediately below the move tool (at least it is in version 4.15)), you can move the header from one side of the board to the other.
RC wrote:So if the top and bottom settings for Pads on the Restring tab of the DRC are the same, I'll get a solder pad on both the top and bottom of a two layer board. Is that correct?Yes.
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