- Wed Apr 30, 2008 12:23 pm
#47372
Im using a AP1117 LDO in a SOT89-3L package. They have a current limit of 1.1A. On my proto type board I dident do anything as far as thermal management for the device, and it enters thermal shutdown when I have .5A going through it. I obviously want to fix this for the next proto. What are the options for such a task? Can I just put large planes on the output tab on both sides of the board and chuck many vias in it to act like a heat sink, or should i do just a plane on top with out solder mask so i can solder a flat HS to it or something. I have never had to compensate for thermals before in a design so this is something new to me. Thanks
Paul "Chupa" Mac