- Mon Apr 17, 2006 11:32 am
#12385
I am slowly venturing into hotplating or reflowing my own boards. Just curious, how do you guys keep e.g. 0402 components in place on your board prior to reflow? Seems to me that applying small drops of glue beneath such components would take lots of time, and it would be easy to forget some components.
Is there some kind of spray, i.e. flux, that can be applied to the board before components are placed, and which would keep the components stuck to the board?
Or is the solderpaste enough to keep components in place? If so, how long can solderpaste be in dry air before the board needs to go in the oven?
Is there some kind of spray, i.e. flux, that can be applied to the board before components are placed, and which would keep the components stuck to the board?
Or is the solderpaste enough to keep components in place? If so, how long can solderpaste be in dry air before the board needs to go in the oven?