BC127/discovery board

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info@rci
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Joined: Fri May 26, 2017 12:40 pm

BC127/discovery board

Post by info@rci » Fri May 26, 2017 12:43 pm

Greetings!

1. Looking at the various datasheets for the module, we understand it to possess two mic inputs (left and right channels) and two speaker outputs (left and right). We are wondering whether the cVc noise cancellation is performed on each mic channel separately or whether they both go into the same noise cancellation profile/program before reaching their output.

2. Are the left and right mic inputs tied to the respective left and right speaker outputs? Can we, say, route the left channel mic input to the right speaker and the right mic to the left speaker?

3. What kind of communication is possible between the boards? We understand that the BC127 is capable of I2C connections, so we are wondering whether we can control PIO/GPIO on the slave boards through the master's PIO/GPIO. Also, can we can transmit and receive audio signals between the boards through I2C as well?

4. We noticed the BC127 has two boards available for purchase-and evaluation (or discovery kit) board, and a development board. What is the difference between the two?

5. Is the melody software included with the purchase of either board, or is there extra licensing costs?

6. We know that the voice cancellation technology used by the module is Qualcomm's cVc algorithm suite. What is the latest version/generation of cVc, and can it be updated to newer versions in the BC127 module if one were to be released?

7. Is the BC127 capable of local sidetone? In other words, can the input to the mic be fed back to the speaker output so a user can hear themselves through a headset as they speak into the mic.

The purpose of this project is to ultimately integrate wireless Bluetooth technology into our racing radio and intercom systems, and also take advantage of the advanced cVc noise cancellation technology present within these chips. Currently, we are using a separate DSP to process each input line, which takes up a lot of space and power. We are hoping that these chips can help with this by handling the noise cancellation process of multiple input audio signals through the same DSP.

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